研究人员用超脸光学元件收缩高光谱成像

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Relying on cleverly designed dielectric optical metasurfaces, researchers from the California Institute of Technology have demonstrated an ultra-compact hyperspectral imager (HSI) that could easily be integrated into smartphone and wearables, without the need for bulky optics.
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The researchers describe the HSI element as a folded metasurface platform comprising three reflective and one transmissive dielectric metasurfaces all integrated on a gold-mirrored glass substrate about 1mm thick, in one lithographic step. Looking closer, the metasurfaces consist of α-Si nanoposts with rectangular cross sections, resting on the fused silica substrate and capped by a 2μm thick layer of SU-8 photoresist. The metasurfaces are designed to collectively disperse and focus light of different wavelengths and incident angles on a focal plane parallel to the glass substrate. Light to be analysed enters the HSI through an input aperture in the front gold mirror and is deflected into the substrate and vertically dispersed by the first metasurface. The other two reflective metasurfaces together with the transmissive one focus light with different wavelengths and horizontal incident angles to diffraction-limited spots on a detector array plane parallel to the substrate. The last metasurface is transmissive and simultaneously acts as the output aperture to collect the spectrum images.

由于对象在高光谱成像仪的前面进行扫描,因此沿方向θ捕获了1D空间图像。Light通过输入孔径进入设备,与反射式元面相互作用,同时将其限制在两个金镜内部的基板内部,然后退出其内置的透射式元图的输出孔径。不同的波长分散在垂直方向(λ),各种输入角度集中在不同的水平点上。

Sharing their findings in the ACS Photonics Journal under the title “Hyperspectral Imager with Folded Metasurface Optics”, the researchers experimentally demonstrated a push-broom HSI, whereby 1D spatial images of an object are captured as it is moved vertically in front of the imager, each scanning slice yielding a full 2D spectrum image on the HSI’s focal plane.

In their experiment, the resulting 3D data cube resolved over 70 spectral points across the 750−850nm infrared range for each pixel acquired along each slice, amounting to a spectral resolution of about 1.5nm. The researchers note a similar hyperspectral imager could be designed to operate in the visible range using silicon nitride or titanium dioxide nanoposts instead of metasurfaces made out of amorphous silicon.

作者还证明了元表面HSI独立于极化,其角度分辨率约为0.075°,能够在±15°范围内区分约400个角方向。小至8.5mm3在体积和重量小于20毫克的体积中,该设备易于在大型晶圆上进行大规模制造,这使得它对在消费电子产品(例如可穿戴设备量和重量限制)中的集成非常有吸引力。

California Institute of Technology –www.caltech.edu

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