智能移动性的车辆计算技术
在交通拥堵的阿姆斯特丹，Congatec推出了新的坚固的车辆计算平台，用于扩展温度范围内的智能移动性应用。这些智能移动性产品旨在简化和加速数字化和自动驾驶，例如运输，物流，建筑和农业，这些智能移动性产品范围从用于下一代实时5G连接，无人驾驶的，功能安全的车辆到设计的实时5G的计算平台到设计的解决方案用于数字化现有舰队的移动运动学。目的是提供高度准确的方向数据，以提高情境意识，并最终优化自动驾驶汽车的运动和操作。
Mobility OEMs and their tier 1 suppliers must tackle a variety of tasks when designing the next generation of smart autonomous mobility controllers: They have to integrate vision and various other sensors for gathering situational raw data, plus implement data preprocessing and artificial intelligence (AI) to improve data analytics, and design controller logic for autonomous vehicle movement and operation. As if all that wasn’t enough, they also need 5G network sliced device connectivity for vehicle-to-vehicle and vehicle-to-x communication. And all this needs to be implemented with real-time capabilities and functional safety.
“Congatec positions itself as the embedded computing platform and ecosystem provider that supports OEMs and their tier 1 suppliers comprehensively in all these tasks, from TSN capable rugged Computer-on-Modules for the extended temperature ranges and real-time hypervisor technologies to application ready OEM platforms provided by solution partners such as Etteplan,” says Christian Eder, Director Marketing at congatec.
Highlights at Intertraffic Amsterdam are the Intel Xeon D processor based COM-HPC Server modules for edge servers in autonomous railway applications and 5G wayside equipment; the 12th Gen Intel Core processor based COM‑HPC Client and COM Express modules for smart vehicle gateways and vehicle network controllers; as well as an application ready, Intel Atom processor based real-time kinematic platform by congatec’s solution partner Etteplan.
Real-time kinematic platform
Based on congatec Computer-on-Modules, the real-time kinematic Etteplan platform features an RTK-enabled GNSS unit with accelerometer, gyroscope and magnetometer and is designed for automotive voltage ranges up to 36 V. The Intel Atom processor based system supports a wide operating temperature range of -40°C to +85°C and provides IP65/67 protection. For connectivity towards the vehicle communication networks, it offers extensions for real-time Ethernet (TSN), RS232, RS485 and CAN. Further edge connectivity options include Wi-Fi and Bluetooth as well as LTE/5G. Ambient pressure, humidity and temperature sensors round off the feature set. The platform is available as a prototype that can be ordered immediately for engineering purposes. For larger quantities, customization is possible on a project basis. The standard system platform is scheduled to go into series production in the second half of 2022.
带有Intel Xeon D处理器的COM-HPC服务器模块
具有Intel Xeon D处理器的E尺寸E和D大小的新型COM-HPC服务器模块旨在加速与温度范围扩展的坚固型车辆和移动性环境中的下一代实时Microserver工作负载。改进包括多达20个核心，最多1 TB RAM，与Gen 4相比，每个PCIE车道的双吞吐量以及多达100 GBE连接性和TCC/TSN支持。流量应用程序中的目标用例范围从在5G触觉互联网应用程序中部署的室外服务器到火车中的服务器以及基于视觉的公共和基础设施安全应用程序。
Computer-on-Modules with 12th Gen Intel Core processors
Featuring 12th Generation Intel Core processors, the new congatec modules in COM-HPC Size A and Size C as well as COM Express Type 6 form factors offer major performance gains and improvements for the next generation of smart mobility systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. With up to 14 cores on BGA variants, 12th Gen Intel Core processors provide a quantum leap in multitasking and scalability to accelerate multithreaded vehicle applications and to execute dedicated real-time tasks more efficiently. In addition, with up to 96 Execution Units, the integrated Intel Iris Xe graphics is estimated to deliver extraordinary improvements of up to 129 percent in GPGPU processing to accelerate parallelized workloads such as AI algorithms, as compared to 11th Gen Intel Core processors.
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