Leveraging decoupling capacitance of regular power grids

With each passing year and each lower technology node, design speeds are increasing tremendously. High frequency designs take a toll on the power integrity of ICs and induce more noise and ringing into the power supply network because of the increased signal switching speeds. This leads to the need for increased decoupling capacitance to address the power supply noise. The decoupling capacitance required in this case would be most beneficial, if present on the die itself. However, more on-die decap implementation would be an overhead and would increase silicon cost. Hence, there is a strong need to increase the effectiveness…