本白皮书提供了技术依据or the creation of chiplet-style component assembly made from multiple die manufactured using processes optimized for different funcationalities. It goes on to provide an overview of the Universal Chiplet Interconnect Express (UCIe). This is an open, multi-layered specification that defines the interconnect between…Read More
本白皮书提供了技术依据or the creation of chiplet-style component assembly made from multiple die manufactured using processes optimized for different funcationalities. It goes on to provide an overview of the Universal Chiplet Interconnect Express (UCIe). This is an open, multi-layered specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.
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