2022年的十种技术趋势

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市场分析公司Trendforce已列出了10个主要趋势清单,预计2022年多个应用程序领域的进展。阅读更多
彼得·克拉克(Peter Clarke)

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铸造行业移至3NM和全能制造工艺

TSMC and Samsung are expected to announce production of their respective 3nm process technologies in 2H22. While the former will continue to adopt the FinFET architecture that it has been using since the 1Xnm node, Samsung will for the first time utilize its own implementation of GAAFET, called MBCFET (multi-bridge channel field-effect transistor) for its 3nm process technology.

GAFET设计通过使门对通道的更大程度的控制来减少泄漏电流。在2H22中3NM节点上生产的第一批产品质量预计是高性能计算和智能手机芯片。

DDR5 DRAM to enter mass production, NAND Flash stacking to exceed 200 layers

Samsung, SK Hynix, and Micron will start mass production of DDR5 DRAM components while increasing the penetration of LPDDR5 DRAM in the smartphone market in response to demand for 5G smartphones. With memory speed in excess of 4800Mbps, DDR5 DRAM can improve computing performances and low power consumption.

英特尔将释放CPU,以支持Alder Lake的个人计算机和服务器计算机的Eagle Strea支持DDR5内存。预计到2022年底,DDR5预计将占总钻头产量的10%至15%。三星和SK Hynix将使用极端的紫外线光刻开始生产1-Alpha NM工艺技术。

NAND Flash的供应商将从2021年的176升迁移到2022年及以上的供应商,尽管零件密度仍保持在512GBYTE和1TBYTE。

下一步:SIC和GAN


第三代半导体过程移至200mm晶圆

So-called third-generation semiconductor processes – SiC and GaN – will move to 200mm-diameter wafers.

电动汽车和5G电信的兴起正在对SIC和SI底物产生持续的需求。目前,底物生产受到限制,在6英寸晶片上最一致,但这导致铸造厂和IDMS的生产能力长期短缺。

作为响应的基板供应商,包括Cree,II-VI和Qromis,现在计划将其SIC和GAN生产迁移到200mm晶片。同时,诸如TSMC和Vanguard之类的铸造厂试图转移到gan-on-on-si和Infineon的200mm晶圆制造,正在释放其在200mm Wafers中生产的凉爽MOSFET。

微/迷你LED显示开发将围绕活跃的矩阵解决方案旋转

TVs represent one of the major directions of mainstream Micro LED development, primarily because TVs, compared to IT products, have a relatively low technological barrier of entry.

At the same time LCDs equipped with mini LED backlights show increased numbers of chips per panel in efforts to raise contrast ratios to 1:1,000,000 comparable to OLED displays.

AMOLED displays, folding forms and under-display cameras will impact smartphones

2022年添加到AMOLED面板中的主要值可能会继续是不断改善的可折叠设计,该设计将具有优化的重量减轻和功率效率。除了可以展开类似平板电脑的尺寸的主流可折叠手机外,翻盖式设计(例如翻转和翻转智能手机车身)也将成为一种形式,它更像当前正在使用的智能手机。

其他可折叠设计,包括智慧形式因素h even more folds or rollable form factors, are expected to enter production within the near future. TrendForce expects foldable phones to reach a penetration rate of more than 1 percent in 2022 and 4 percent in 2024.

Low-temperature polysilicon OLED (LTPO) panels are set to become the mainstream display panel for flagship smartphones.

Next: 5G and satellite mobile


5G独立试验和低延迟应用的网络切片

Communications applications that are at the intersection of 5G, massive IoT, and critical IoT will emerge in response to enterprise demand. These applications, including light switches, sensors, and thermostats used in smart factories, involve the combination of network endpoints and data transmission. In particular, critical IoT applications include smart grid automation, telemedicine, traffic safety, and industrial automation, whereas critical IoT use cases within the context of Industry 4.0 include asset tracking, predictive maintenance, FSM (field service management), and logistics optimization.

卫星操作员将与移动电信竞争,因为3GPP支持非事物网络

3GPP最近宣布,版本17协议编码冻结将于2022年进行。版本17代表3GPP首次将非事物网络通信纳入其发行版,因此标志着移动通信行业和卫星通信行业的重要里程碑。

Regarding the deployment of low earth orbit satellites, US-based SpaceX has applied to launch the highest number of satellites among all satellite operators. Other major operators include Amazon, UK-based OneWeb, Canada-based Telesat.

Leo卫星提供的信号覆盖范围不受地理特征的影响,例如山区,海洋和沙漠,但它们也能够与5G网络协同作用。因此,TrendForce预测2022年全球卫星收入的增长会增加。

IoT to drive digital twinning and the metaverse

2022年的物联网开发可能会集中在结合5G,边缘计算和AI技术的网络物理系统(CPS)上,以从广泛的数据流中提取和分析有价值的信息,以实现智能自动化和预测的目的。

Digital CPS twin are being deployed for smart manufacturing and smart cities. Cyber-physical systems are being extended via 3D sensing, virtual and augmented reality capabilities. The IoT-based metaverse will likely emerge as a smart, real-time, and safe mirror to the physical world, and the first application of the IoT-based metaverse is expected to be smart factories.

下一步:沉浸


AR/VR to become more immersive with addition of sensors and AI processing

The Covid-19 pandemic has accelerated the pace of digital transformation and there is demand to across multiple enterprise and consumer applications to increase the degree of immersion.

通过改进的感应和图形,虚拟社区和在线游戏可能会在2022年推动AR/VR市场的扩展。例如,眼睛追踪功能将成为Oculus和Sony发布的消费产品的可选功能。AR/VR解决方案可能开始通过控制器或其他可穿戴设备向用户提供部分触觉反馈。

持续扩展自动驾驶技术

自动代客停车是SAE 4级无人驾驶停车服务,预计将成为2022年开始的高端车辆的重要可选功能。但是,由于AVP系统根据车辆规格而有所不同,因此它们受到与驾驶条件相关的各种限制,包括固定/未修复的路线和私人/公共停车位,而停车场的条件(例如无线网络连接和交通标记的全面性)也会影响AVP的可行性。

相关链接和文章:

www.trendforce.com

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