Wi-Fi 4 combo module designed for IoT

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Wireless connectivity specialist Laird Connectivity has introduced a Wi-Fi 4 with Bluetooth 5.2 module based on the latest Infineon AIROC CYW43439 chipset.Read More
By Rich Pell

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The latest member of the company’s Sterling radio family, theSterling-LWB+Wi-Fi 4 (802.11 b/g/n) and Bluetooth 5.2 module, was designed for IoT from the start, says the company. It is fully certified, easy to integrate, industrial temperature rated, and offered as the fastest route to the market for wireless IoT applications, while also being mechanically and pin compatible with the Sterling-LWB module as an upgrade path for existing customers.

The module series delivers a fully featured Wi-Fi 4 radio enabled with the company’s software drivers and support. The secure, high-performance SDIO solution can be easily integrated with any Linux or Android based system, with RTOS software integration coming soon.

“The LWB+ has given Laird Connectivity the option to provide our customers an extended life cycle for our Wi-Fi products, delivering a state-of-the art Wi-Fi 4 solution with the latest features and head room to grow,” says Andy Ross, Senior Product Manager, Laird Connectivity. “This means our customers with long product cycles have a solution they can rely upon. In partnership with Infineon, we’ve been able to integrate a leading-edge chipset and deliver a highly reliable, industrial temperature range solution.”

The Sterling-LWB+ offers high quality drivers and extended product life support, and the company’s Linux Backports package ensures compatibility for a broad range of Linux kernels. The module also supports the latest WPA3 security standards.

“Laird Connectivity’s new Sterling-LWB+ Wi-Fi/Bluetooth wireless module with our robust and reliable AIROC CYW43439 Wi-Fi 4 + Bluetooth 5.2 SoC expands the scope of our wireless connectivity solutions, enabling faster time to market for a wide range of applications,” says Sivaram Trikutam, Senior Director, IoT Compute and Wireless, Infineon Technologies. “Our broad AIROC portfolio includes high-performing, reliable, ultra-low-power products that deliver robust industry-leading performance.”

Sterling-LWB+可作为系统包装(SIP)和两个经过认证的PCB模块版本提供,支持板载芯片天线或用于外部天线的MHF连接器,可以连接到LAIRD连接范围经过内部认证的范围天线。该模块有意旨在满足医疗和工业物联网应用的需求,包括坚固的手持设备,工业物联网连接,工业物联网传感器和电池供电的医疗设备。

认证包括FCC、我SED, CE, UKCA, RCM, MIC, and Bluetooth SIG registration. The modules and evaluation kits are available now from Laird Connectivity’s distribution partners.

Laird Connectivity

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