eeNews Europe-electronics products, power, boards, analog, automotive, embedded

Researchers from Georgia Tech’s College of Engineering have developed a 3D printed tile to boost the bandwidth of next generation 5G cellular and IoT systems using multiple antennas. The 3D printed tile-based approach scales to 256 antennas to construct on-demand, massively scalable arrays of 5G+ (5G/Beyond 5G) smart skins on…

CEA, Soitec, GlobalFoundries and STMicroelectronics are working together on the industry’s next generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology ready for 6G designs. Research groups CEA and Soitec are based in France, while the ST fab in Crolles in France uses FD-SOI manufacturing at 28nm. GF has a key…

Intel has launched a chip to accelerate the use of distributed ledger blockchain secure applications. This uses the same technology that was in the cryptocurrency mining Bitminer chip detailed in February at the ISSCC conference. The Blockscale application-specific integrated circuit (ASIC) aims to make the underlying technology of the blockchain…

Digital twin software from Siemens is being used to develop an underwater greenhouse to grow fruit and vegetables. A digital twin being developed by Italian startup Nemo’s Garden is helping designers to quickly iterate design and testing of the sustainable sub aqua biosphere. The Xcelerator digital twin uses machine learning…