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首次HomeGrid论坛认证G.hn system on module (SOM) for Industrial Internet of Things (IIoT) applications communicating over powerlines. The certification of the GHN.SOM.PLC module from Teleconnect in Dresden uses MIMO (multiple in, multiple out) powerline communications for data rates up to 1.8Gbit/s. The SOM module has three versions…Read More
By Nick Flaherty

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首次HomeGrid论坛认证G.hn system on module (SOM) for Industrial Internet of Things (IIoT) applications communicating over powerlines.

The certification of the GHN.SOM.PLC module from Teleconnect in Dresden uses MIMO (multiple in, multiple out) powerline communications for data rates up to 1.8Gbit/s.

The SOM module has three versions for powerline, coax and phone lines, coupling without insulation on-module. The module is certified to work with various G.hn-chipsets and devices, guaranteed coexistence (G.9972) as well as Ethernet via SGMII, RGMII and MII interfaces with direct solder-on or versatile 2.0 mm pin-header interfaces.

“This certification marks an exciting new milestone for G.hn IIoT use cases, including autonomous mobile robots, smart sensors, AR/VR, smart lifting, smart parking systems control, smart buildings entry-door access control, safety control and factory automation,” said Livia Rosu, HomeGrid Forum President.

G.hn works on existing wiring to provide low latency connectivity that is suitable for handling two-way, high bandwidth and real-time traffic, including environmental sensors and video surveillance. HomeGrid Forum has recently formed a new Task Force, co-chaired by Alexandre Schäfer, Head of Sales, and Philipp Rietzsch, Head of R&D, at Teleconnect, to drive G.hn innovation and deployments for IIoT applications.

“G.hn has significantly boosted industrial networks with adaptive data rates of up to 1.8 Gbps over different media, from powerline to telephone wiring and coax cables. It has also proven to be the most reliable backbone for visible light communications, such as LiFi,” said Said Schäfer. “Now, the certification of GHN.SOM.PLC means that the industry can be confident in the module’s interoperability to other G.hn chipsets and devices.”

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