美国五项研发项目为500万美元，为传感器，医疗设备，汽车电子和其他消费者和工业微电子产品开发灵活的混合用电子（FHE）。

“新项目以私营部门独自资助的方式推动技术的极限，说明了半肥克斯计划在多重高速增长行业发展中的SEMI Flextech计划的重要性，”研发计划主任Gity Samadi表示半肥料。“灵活的混合动力车电子有助于将传统的刚性产品转换为符合，高度可靠，通常更可持续的设备。”

ACI Materials will optimize the performance of its Alchemy high-film-thickness conductive sintering and semi-sintering pastes, inks, and coating for additive manufacture of higher performance FHE and direct writing in 3D printed circuit structures. Advanced inks are a key enabler to the continued growth of 3D printed components, a rapidly growing manufacturing capability. ACI is teaming with nScrypt for this 18-month project costing $510,000.

华盛顿大学将展示一种系统的方法，可以采用电流动力喷墨印刷的原位监测和机器学习控制，实现2D光学，互连和柔性器件的适应性和可扩展的微米制造。UW将与Iowa State University，Sijtechnology，网络制造和计量解决方案和肯特展示在848,847美元的项目中进行团队。

Cornell University will apply artificial intelligence (AI) to increasing the reliability of printed electronics using optical and ultrasonic metrologies and acoustic emissions. Cornell will team with BotFactory and Geegah LLC on this $575,000 project.

GE Research will develop and demonstrate a bio-inspired soft robot for assisting a human operator in performing inspection maintenance and repair (IMR) in highly confined spaces inside industrial and defense facilities. GE Research will collaborate with Binghamton University, Georgia Tech and UES on this 18-month project costing $2 million.

GE Research will develop a high-power (≥1.2kV), low-profile, low-inductance silicon carbide power module using conformable direct write interconnects and packaging. Costing $1.8 million, the 18-month project promises to make high-power, high-voltage and high-current electronics more customizable and reduce the cost of producing them in low volume.

Flextech研发计划得到了美国陆军研究实验室（ARL）的支持，基于马里兰州阿德利。

More information on theSEMI-FlexTech funding programme

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