Performance boost with ten embedded Alder Lake boards
德国董事会制造商Congatec使用COM-HPC和COM Express计算机上的第12代英特尔核心处理器（Alder Lake）推出了十大嵌入式电路板。
COM-HPC大小A和C以及COM Express类型6形式因子中的模块为嵌入和边缘计算系统提供了显着的性能提升。
Alder Lake是具有小型，功率优化的核心和较大核心的关键变化，可实现更高的性能和多线程操作。BGA软件包版本最多支持14个核心和20个线程，其中LGA上的LGA封装桌面变体上有16个核/ 24个线程，用于COM-HPC（高性能计算）板。这些使用高达6或8（BGA / LGA）性能 - 核（P-CORES）加上最多8个低功耗效率（E-CORES）和DDR5内存支持，以加速多线程应用程序并更有效地执行背景任务。
The mobile BGA processors also include up to 96 Execution Units of the integrated Intel Iris Xe GPU to boost embedded graphic performance and can also be used for machine learning and artificial intelligence (AI) algorithms
The graphics of the LGA processor based modules delivers now up to 94 percent faster performance and its image classification inference performance has nearly tripled with up to 181 percent higher throughput. In addition the modules provide higher bandwidth with the COM-HPC specification to connect discrete GPUs for maximum graphics and GPGPU based AI performance.
Compared to the BGA versions, these and all other peripherals benefit from doubled lane speed as they come with PCIe 5.0 interfaces in addition to PCIe 4.0 off the processor. The desktop chipsets also provide up to 8x PCIe 3.0 lanes for additional connectivity and the mobile BGA variants also offer up to 16x PCIe 4.0 lanes off the CPU and up to 8 PCIe 3.0 lanes off the chipset.
使用BGA和LGA变型的电路板旨在高端嵌入式和边缘计算机系统，如IOT网关，包括用于智能工厂的多个虚拟机和过程自动化，AI基于AI的质量检测和工业视觉，实时协作机器人和自主物流用于仓库和运输的车辆。典型的户外应用包括自动车辆和移动机器，视频安全和运输和智能城市的网关应用，以及5G Cloudlet和需要AI支持的数据包检查的Cloudlet和Edge设备。
“Leveraging Intel’s innovative performance hybrid architecture with impressive P – core performance in combination with power efficient E – cores Intel Thread Director assigns each workload to the proper cores for optimum performance,” said Christian Eder, Director Marketing at congatec and one of the architects of the COM-HPC specification.
“所选处理器也适用于具有英特尔TCC和TSN的硬实时应用。结合全部支持实时系统的管理程序技术，它们是在一个边缘平台上巩固多个不同工作负载的理想平台。由于这适用于低功耗和高性能场景，它可以实现具有小型生态足迹的高度可持续设计，“他说。
COM-HPC客户端和COM Express类型6模块支持Windows ML，OpenVino Toolkit和Chrome交叉ML的Intel分发。不同的AI工作负载可以将其无缝地委派给P-Cores，E-Cores以及GPU执行单元，以处理即使是最强烈的Edge AI工作负载也是如此。
内置英特尔深度学习使用不同的核心通过矢量神经网络指令（VNNI），并且集成的图形支持AI加速的DP4A GPU指令，也可以缩放到专用GPU。英特尔的最低功率内置AI加速器，英特尔高斯和神经加速器3.0（英特尔GNA 3.0），可以启用动态噪声抑制和语音识别，并且可以在处理器处于低功耗状态时运行，用于唤醒语音命令。
Combining these features with support for Real-Time Systems’ hypervisor technology as well as OS support for Real-Time Linux and Wind River VxWorks, makes these modules a truly rounded ecosystem package to facilitate and accelerate the development of edge computing applications.
Next: Alder Lake variants
基于第12型Intel核心移动处理器的Conga-TC670 COM Express类型6紧凑型模块（95 mm x 95 mm）和Conga-HPC / CALP COM-HPC客户端尺寸（120 mm x 95 mm）将可用以下配置之后
processo.r |
Cores/(P + E) |
P-cores Freq [GHz] |
电子核心 |
Threads | GPU Compute units | CPU基功率[W] |
| Intel Core i7 12800HE | 14（6 + 8） | 2.4 / 4.6 | 1.8 / 3.5 | 20 | 96 | 45 |
| 英特尔核心I5 12600HE | 12 (4+8) | 2.5 / 4.5 | 1.8 / 3.3 | 16 | 80 | 45 |
| Intel Core i3 12300HE | 8 (4+4) | 1.9 / 4.3 | 1.5 / 3.3 | 12 | 48 | 45 |
12th Gen Intel Core desktop processor based conga-HPC/cALS COM-HPC Client Size C modules (120 mm x 160 mm) will be available in the following variants:
processo. |
Cores/ |
P-cores |
电子核心 |
Threads | GPU Compute Units | CPU base power [W] |
Intel Core i9 12900E |
16 (8 + 8) | 2.3 / 5.0 | 1.7 / 3.8 | 24 | 32 | 65 |
| Intel Core i7 12700E | 12（8 + 4） | 2.1 / 4.8 | 1.6 / 3.6 | 20 | 32 | 65 |
Intel Core i5 12500E |
6 (6+0) | 2.9 / 4.5 | 12 | 32 | 65 | |
| Intel Core i3 12100E | 4 (4+0) | 3.2 / 4.2 | 8 | 24 | 60 |
所有的模块都与RTOS董事会增刊ort packages including hypervisor support from Real-Time Systems as well as Linux, Windows and Android.
www.congatec.com/en/products/com-hpc/conga-hpccals/;
www.congatec.com/en/products/com-hpc/conga-hpccalp/;
www.congatec.com/en/products/com-express-type-6/conga-tc670/
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