3D堆栈技术的X-FAB团队
X-Fab硅铸造厂已授权一个高容量printing technology that allows SOI, GaN, GaAs and InP, as well as MEMS to be combined in a 3D stack.
通过微型转移打印（MTP）进行的量异构集成的交易与X-Celeprint有关，并随后在工作流程和洁净室进行了两年的投资以提供3D堆栈。
X-Celeprint’s proprietary massively-parallel pick-and-place MTP technology stacks and fans-out ultra-thin die, called x-chips, based on different process nodes, technologies, and wafer sizes using an elastomeric transfer stamp. This stamp lifts many die in parallel from the source wafer, depositing them on destination wafer dies with high precision.
例如，邮票可以转移16 x 16个模具，每个模具包含12 x 3 x芯片，共同将9,216个模具同时转移到目标晶圆，重复直至填充晶片。X芯片在模具上的间距允许风扇，其中选择了从源晶片中选择的交错模具。标准的后端线（Beol）技术连接X芯片。
This allows 3D stacked ICs to be built in a high volume process and will allow customers to work with the foundry on heterogeneous design projects, benefitting from a low-risk and fully scalable business model that offers a clear migration to volume production.
The X-Celeprint MTP technology is covered by over 300 worldwide patents and 189 pending applications and at the moment has an R&D advanced packaging line for rapid prototyping at its headquarters at the Tyndall National Institute in Cork, Ireland. This has so far been popular with microLED display makers. Another line is also co-located with a 200mm fab by Micross in Research Triangle Park, North Carolina. X-Celeprint is a subsidiary of Belgian holding company XTRION NV that is the majority owner of X-fab and Melexis and has investments in Helix Semiconductors and Spectricity.
Related articles
- X-Fab Silicon Foundries tapes-out open-source RISC-V MCU
- X-fab将我们移至SIC，添加了EPI
- X-Fab to swallow Altis Semiconductor
- Bluglass和X-Celeprint Prototype P-GAN微胶片显示器
- MicroLED race shows Apple in the lead
X-Fab has six production facilities in Germany, France, Malaysia and the US, while X-Celeprint has research partnerships with the University of Ghent/imec as well as the University of Illinois Urbana Champaign in the US.
“By licensing X-Celeprint’s disruptive MTP technology, we are uniquely positioned in our ability to facilitate the incorporation of numerous different semiconductor technologies. X-FAB customers will be able to utilize a technology that no other foundry is offering, and existing X-Celeprint customers may now tap into capacity levels that will easily meet their future demands,” said Volker Herbig, VP of X-FAB’s MEMS business unit.“As a result, we can assist customers looking to implement complete multifunctional subsystems at the wafer level, even when there are high degrees of complexity involved. Signal conditioning, power, RF, MEMS, and CMOS sensors, optoelectronic devices, optical filters, and countless other possibilities will all be covered,” he said.
X-Celeprint首席执行官Kyle Benkendorfer说：“我们与X-FAB的协议代表了MTP技术商业化的一个重要里程碑，扩大了客户和应用的数量。”“从各种不同源晶片中得出的元素的大量异质整合将为半导体行业提供重要的新功能，包括访问具有更多功能，高产和较低成本（较短的时间范围内）的更高密度设备。”
www.xfab.com;www.x-celeprint.com
其他相关文章
Other articles on eeNews Europe
- Renesas完成了48亿欧元的对话者半导体的收购
- First stacked SPAD ToF depth sensor for automotive LiDAR
- Wittenstein sets up €5m foundation
- Philips completes sale of domestic appliances business
- Nexperia defends Newport deal
- TSMC价格上涨以驱动全球设备成本
- Marvell创始人返回数据中心RISC-V chiplet创业公司
