An interposer is a high-performance intermediate device that electrically connects multiple chips and substrates and the technology is expected to play a key role in next-generation semiconductor packaging.
该公司已成为JISSO公开创新的一部分Tops 2（intig2）财团，与其他11家公司开发了2024年开发群众生产技术的公司。该财团由Showa Denko Materials管理。
插入器的尺寸为40 x 40mm，克服了接线阻力增加的问题，以及接线之间的绝缘电阻降解，以达到前缘半导体包装所需的高性能。
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DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes.
“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology,” said Ryoichi Ohigashi of the Research and Business Development Center, DNP.
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